Sub-Micron Table Top Die Bonder -sawan实验室

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Sub-Micron Table Top Die Bonder

Introduction

The table top flip chip bonder FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more. The completely revised table top die bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility of the table top die bonder to protect your investment in the face of ever-changing challenges.

Characteristics

Device Name	Sub-Micron Table Top Die Bonder
Model	Finetech Lambda 2
Characteristics	-Sub-micron placement accuracy -Superior optical resolution -Excellent price performance ratio -Manual or semi-automatic machine versions -Individual configurations with process modules -Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic) -Data/media logging and reporting function -Wide range of controlled bonding forces -Various bonding technologies in one recipe -Process module compatibility across Finetech platforms -Modular machine platform allows in-field retrofitting during entire service life -Synchronized control of all process related parameters -Overlay vision alignment system (VAS) with fixed beam splitter

Device Name

Sub-Micron Table Top Die Bonder

Model

Finetech Lambda 2

Characteristics

-Sub-micron placement accuracy

-Superior optical resolution

-Excellent price performance ratio

-Manual or semi-automatic machine versions

-Individual configurations with process modules

-Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)

-Data/media logging and reporting function

-Wide range of controlled bonding forces

-Various bonding technologies in one recipe

-Process module compatibility across Finetech platforms

-Modular machine platform allows in-field retrofitting during entire service life

-Synchronized control of all process related parameters

-Overlay vision alignment system (VAS) with fixed beam splitter